High precision knife blades for iPhone mainboard repair, ultra-thin knife blade for removing phone CPU BGA IC chip from motherboard, remove chip from the motheRboard at the end, rubber shovel UV glue knife disassembly cleaning graver.
- 27-in-1 BGA disassemble blade set is for iPhone A9 A8 A10 A11 Logic Board BGA Chip repair tool kit.
- Specialized iPhone repair tool for CPU blade remove chip edge glue.
- Ultra-thin 0.05mm blade, capricious good, it can ease between the chip and the board at the end, is not easy to lead off point.
Over the past month we have had a very large demand. Due to this high demand please allow a total of 2-4 weeks for this product to arrive at your door.